Finite Element Analysis

Reliability Physics Analysis Tools for Implementing DO-160G STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the DO-160G standard which covers “Environmental Conditions and Test Procedures for Airborne Equipment” in the aerospace industry. PCBs installed in any airborne vehicles can be simulated in Ansys Sherlock to assess the vibrational and solder fatigue analysis in order to predict the life cycle/ Time-to-failure (TTF) of key components and the board itself.

Weld Creation in Ansys Mechanical 2022 R1

Welding is a commonly used method that plays a crucial role in the safety, structural integrity, and durability of many fabricated structures. Learn about the significant new features in Ansys Mechanical 2022 R1 which greatly aide the preparation of FEA models involving welded structures and will save you many days of model preparation time.

Reliability Physics Analysis Tools for Implementing GMW3172 STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the GMW3172 Standard for “General Specification for Electrical/Electronic Components – Environmental/Durability”, part of engineering standards by General Motors which applies to electrical components for passenger/commercial vehicles & trucks.

Reliability Physics Analysis Tools for Implementing SAE J3168 STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.

Part 1: Using Simulation of Electronics Reliability to address industry standards (SAE J3168, MIL-810G, GMW3172 and/or DO-160G)

It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.

LEAP’s Highlights from Ansys 2022 R1 release – Structures

Learn more about improvements in performance, usability, speed and model physics in Ansys 2022 R1 for Structures. Here we look at general FEA highlights and new features of broad interest to our customers plus a 2nd video exploring the new capabilities of the Ansys Noise, Vibration and Harshness (NVH) Toolkit.

thyssenkrupp presentation at Ansys FEA User Group: FEA for Balanced Machines

Guest post by Daniel Haasbroek, Principal Engineer Structural, thyssenkrupp industrial solutions including the recording of Daniel’s presentation at 2021 Ansys FEA User Group. Daniel has worked at thyssenkrupp for the past 14 years as a structural engineer specialising in balanced machines.

Free Training: Scripting for Ansys Mechanical

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Recently LEAP delivered online training on scripting for Ansys Mechanical which was very well received by our customers. In this post we have made the recordings of these two training sessions available to the wider Ansys community, so if you would like to learn how Ansys Mechanical scripting can help to improve your efficiency, please read on.

Simulation Solutions for Electronics Reliability

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Ansys Sherlock helps automate PCB testing to accurately predict failure risks due to thermal, mechanical and manufacturing stressors using a process that is much faster than traditional simulation due to rapid ECAD translation and a component library helping you to create a complete mechanical model of your PCB.

Batch Connections in Ansys – Never use Share Topology for Beam and Shell models

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Learn how the new Batch Connections in Mechanical enables efficient meshing of large beams and shell structures – significantly faster and with a better quality mesh. This new patent-pending technique replaces the tedious and time-consuming approach using ‘shared topology’.