Fatigue

Mastering Structural Analysis: Integrating External Loads into Ansys Mechanical

Modern engineers often work on the design of increasingly complex systems that will experience a multitude of simultaneous loading factors – such as forces, thermal effects, and pressure. Ansys Workbench offers a range of options to streamline the process of incorporating these external loads into Ansys Mechanical so that Ansys users can accurately predict stress, strain and fatigue life for such complex systems with greater precision.

Making Informed Material Selections in Ansys Mechanical

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Material selection affects the behaviour, performance, and durability of a product. This blog explores material selection options and how to speed up this process in Ansys Mechanical using the comprehensive material database and tools to evaluate and compare the material behaviour.

How will AI impact the role of engineers in 2023 and beyond? We asked OpenAI’s ChatGPT!

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The internet is abuzz with excitement about ChatGPT, the new AI chatbot that allows you to interact with one of the world’s largest and most powerful AI models. Recent media coverage has ranged across the spectrum from hype to nope, but at LEAP we wanted to investigate further so we decided to go straight to the source – so we posed a series of questions directly to ChatGPT!

Reliability Physics Analysis Tools for Implementing MIL-810G STANDARD

In the final part of our series on using Electronics Reliability simulation tools to meet important industry standards, read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to meet the MIL-STD-810G standard relating to environmental and lab tests approved for use by the US Department of Defence.

Reliability Physics Analysis Tools for Implementing DO-160G STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the DO-160G standard which covers “Environmental Conditions and Test Procedures for Airborne Equipment” in the aerospace industry. PCBs installed in any airborne vehicles can be simulated in Ansys Sherlock to assess the vibrational and solder fatigue analysis in order to predict the life cycle/ Time-to-failure (TTF) of key components and the board itself.

Weld Creation in Ansys Mechanical 2022 R1

Welding is a commonly used method that plays a crucial role in the safety, structural integrity, and durability of many fabricated structures. Learn about the significant new features in Ansys Mechanical 2022 R1 which greatly aide the preparation of FEA models involving welded structures and will save you many days of model preparation time.

Reliability Physics Analysis Tools for Implementing GMW3172 STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the GMW3172 Standard for “General Specification for Electrical/Electronic Components – Environmental/Durability”, part of engineering standards by General Motors which applies to electrical components for passenger/commercial vehicles & trucks.

Reliability Physics Analysis Tools for Implementing SAE J3168 STANDARD

Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.

thyssenkrupp presentation at Ansys FEA User Group: FEA for Balanced Machines

Guest post by Daniel Haasbroek, Principal Engineer Structural, thyssenkrupp industrial solutions including the recording of Daniel’s presentation at 2021 Ansys FEA User Group. Daniel has worked at thyssenkrupp for the past 14 years as a structural engineer specialising in balanced machines.

ANSYS Simulation results for Printed Circuit Boards (PCBs)

Moving towards a Comprehensive Virtual PCB Testing Platform

Trends such as such as Industry 4.0, the Internet of Things (IoT), drones, smart home technology and autonomous vehicles are continuing to push PCB technology to its limits. Electronics engineers are now needing to focus on more than just the electromagnetics aspects of PCB design, and are increasingly concerned about power consumption, thermal & vibration issues linked to reliability concerns in harsh environments.