ANSYS

Part 1: Using Simulation of Electronics Reliability to address industry standards (SAE J3168, MIL-810G, GMW3172 and/or DO-160G)

It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.

LEAP’s Highlights from Ansys 2022 R1 release – Structures

Learn more about improvements in performance, usability, speed and model physics in Ansys 2022 R1 for Structures. Here we look at general FEA highlights and new features of broad interest to our customers plus a 2nd video exploring the new capabilities of the Ansys Noise, Vibration and Harshness (NVH) Toolkit.

thyssenkrupp presentation at Ansys FEA User Group: FEA for Balanced Machines

Guest post by Daniel Haasbroek, Principal Engineer Structural, thyssenkrupp industrial solutions including the recording of Daniel’s presentation at 2021 Ansys FEA User Group. Daniel has worked at thyssenkrupp for the past 14 years as a structural engineer specialising in balanced machines.

Simulation Solutions for Electronics Reliability

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Ansys Sherlock helps automate PCB testing to accurately predict failure risks due to thermal, mechanical and manufacturing stressors using a process that is much faster than traditional simulation due to rapid ECAD translation and a component library helping you to create a complete mechanical model of your PCB.

Batch Connections in Ansys – Never use Share Topology for Beam and Shell models

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Learn how the new Batch Connections in Mechanical enables efficient meshing of large beams and shell structures – significantly faster and with a better quality mesh. This new patent-pending technique replaces the tedious and time-consuming approach using ‘shared topology’.

Q&A with Douglas: My experiences working with ETNZ in leadup to the 2021 America’s Cup

Q&A with Douglas Weber-Steinhaus from Ansys to learn about his experiences working with ETNZ in Auckland in the leadup to the 2021 America’s Cup (which starts next week!)

I landed my dream job and then COVID-19 hit

We speak with Khesh Selvaganapathi, Graduate Application Engineer at LEAP who recently graduated as a Mechanical Engineer from Monash University & joined LEAP at the start of March 2020 – just a few weeks before the COVID-19 pandemic began causing widespread disruption and forced most LEAP staff to work from home…

Guest Blog by MMS: Centre of Attention – Using FEA to optimise wheel centres for a Formula SAE racecar

Learn how FEA played an important role in the redesign of Monash Motorsport’s wheel centres for their F-SAE cars – reducing the mass from 906g to 731g for each wheel centre from the 2019 to new 2020 design.

ANSYS Simulation results for Printed Circuit Boards (PCBs)

Moving towards a Comprehensive Virtual PCB Testing Platform

Trends such as such as Industry 4.0, the Internet of Things (IoT), drones, smart home technology and autonomous vehicles are continuing to push PCB technology to its limits. Electronics engineers are now needing to focus on more than just the electromagnetics aspects of PCB design, and are increasingly concerned about power consumption, thermal & vibration issues linked to reliability concerns in harsh environments.

Q&A with an Explicit Dynamics Simulation expert – using simulation to meet MIL standards for fatigue, crash and blast scenarios

We recently sat down for a quick interview with Luke Mosse, Specialist Application Engineer at LEAP to find out more about his experience from simulating blast, crash & fatigue using Ansys LS-DYNA, Ansys Mechanical and nCode software.