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ANSYS

Enhancing Materials Science education at the University of Auckland

    The University of Auckland has been teaching materials science & engineering with Granta Edupack since 2015 as part of a commitment to use the latest technology to enhance their Materials Science education.
    Read this recent interview with Dr. Josh Workman who used Granta EduPack as a Lecturer in Materials Engineering.

    Reliability Physics Analysis Tools for Implementing SAE J3168 STANDARD

      Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.

      Part 1: Using Simulation of Electronics Reliability to address industry standards (SAE J3168, MIL-810G, GMW3172 and/or DO-160G)

        It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.

        LEAP’s Highlights from Ansys 2022 R1 release – Structures

          Learn more about improvements in performance, usability, speed and model physics in Ansys 2022 R1 for Structures. Here we look at general FEA highlights and new features of broad interest to our customers plus a 2nd video exploring the new capabilities of the Ansys Noise, Vibration and Harshness (NVH) Toolkit.

          Simulation Solutions for Electronics Reliability

          Ansys Sherlock helps automate PCB testing to accurately predict failure risks due to thermal, mechanical and manufacturing stressors using a process that is much faster than traditional simulation due to rapid ECAD translation and a component library helping you to create a complete mechanical model of your PCB.

          I landed my dream job and then COVID-19 hit

            We speak with Khesh Selvaganapathi, Graduate Application Engineer at LEAP who recently graduated as a Mechanical Engineer from Monash University & joined LEAP at the start of March 2020 – just a few weeks before the COVID-19 pandemic began causing widespread disruption and forced most LEAP staff to work from home…