Highlights from a recent webinar by LEAP’s expert simulation team covering the most significant updates in Ansys for educators and academic researchers in ANZ – with a focus on Structures, Fluids and Electromagnetics across the last 2-3 years.
In the final part of our series on using Electronics Reliability simulation tools to meet important industry standards, read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to meet the MIL-STD-810G standard relating to environmental and lab tests approved for use by the US Department of Defence.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the DO-160G standard which covers “Environmental Conditions and Test Procedures for Airborne Equipment” in the aerospace industry. PCBs installed in any airborne vehicles can be simulated in Ansys Sherlock to assess the vibrational and solder fatigue analysis in order to predict the life cycle/ Time-to-failure (TTF) of key components and the board itself.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the GMW3172 Standard for “General Specification for Electrical/Electronic Components – Environmental/Durability”, part of engineering standards by General Motors which applies to electrical components for passenger/commercial vehicles & trucks.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.
It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.
Trends such as such as Industry 4.0, the Internet of Things (IoT), drones, smart home technology and autonomous vehicles are continuing to push PCB technology to its limits. Electronics engineers are now needing to focus on more than just the electromagnetics aspects of PCB design, and are increasingly concerned about power consumption, thermal & vibration issues linked to reliability concerns in harsh environments.
Learn how ANSYS’ integrated toolset can overcome the complex technical challenges in the development of fully autonomous systems: helping to deliver safe and reliable systems that operate efficiently in complex, changing environments. As engineers, we intuitively understand that comprehensive simulation is the only way to thoroughly consider all real-world scenarios for these systems in a fast and cost-effective way.
[vc_row][vc_column][vc_column_text]After talking to design engineers who are responsible for both Antenna Placement and Co-site Interference simulations, we have heard that they typically desire results to… Read More »Dramatic Accelerations in the Performance of Antenna Placement and Co-site Interference Simulations with NVIDIA GPUs
The Internet of Things has rapidly become a major industry focus with dramatic advancements in low power electronics and in wireless technology. Body-worn communication systems… Read More »Wearable Conformal Antenna Design in Presence of the ANSYS Human Body Model
