Guest Post by Shikhar Gupta, final-year student in the Faculty of Electrical and Computer Systems Engineering at Monash University, Victoria, Australia. Shikhar was a full-time… Read More »Guest Blog – Monash University – FYP brings together best-in-class technologies to create a functioning Digital Twin
[vc_row][vc_column][vc_column_text]At LEAP we have been tracking the development of additive manufacturing (AM, aka 3D printing) very closely for the past decade, and we have no… Read More »Simulation & Additive Manufacturing: letting all your wildest (product design) dreams come true in front of your eyes
At LEAP, we were very proud to play an important role in mentoring the student teams from RMIT to help them deliver their IoT/AR-based solutions… Read More »Guest blog: Student perspective endorses valuable skills gained at RMIT IoT/AR Hackathon
Here at LEAP Australia, we already know how good the IoT and PLM tools from PTC are – Thingworx and Windchill – after all, we… Read More »PTC’s IoT & PLM technology Leading the Pack – awarded “Leader” status across successive independent reports
RMIT University students are eagerly getting ready to tackle the 10 real-world industry problems submitted by companies from a diverse range of industries for the… Read More »Industry problems confirmed – Countdown begins for RMIT IoT/AR Hackathon
Watch the highlights from PTC President and CEO, Jim Heppelmann’s Keynote presentation at LiveWorx 2018 – Innovation Velocity: From A Place To A Pace, including… Read More »LiveWorx18 – Innovation Velocity
Learn how ANSYS’ integrated toolset can overcome the complex technical challenges in the development of fully autonomous systems: helping to deliver safe and reliable systems that operate efficiently in complex, changing environments. As engineers, we intuitively understand that comprehensive simulation is the only way to thoroughly consider all real-world scenarios for these systems in a fast and cost-effective way.
MaD2018: A Collaborative Future for NZ Manufacturing and Design (#MaD2018) – May 21- 22, 2018 The Second National Conference for Innovation in Manufacturing and Design Join… Read More »Don’t miss LEAP’s session at MaD2018: Manufacturing and Design Conference in New Zealand
Initially devised as part of a German government-led strategy to promote digitalisation in manufacturing, the term Industrie 4.0 (aka the fourth industrial revolution) has arisen… Read More »What is Industry 4.0 and what does it mean for us as engineers?
With the trend of more densely packed integrated circuits (ICs) & more layers in printed circuit boards (PCBs) leading to the potential for overheating, thermal design of our electronic products becomes critical. To push the envelope in PCB design, learn how you can use DCIR combined with thermal analysis to increase your PCB reliability and quality.
