We at Leap Australia have been supporting Altium Users for years when it comes to pre-compliance putting the PCB Designs under test. This can be a basic voltage drop analysis, a more advanced DDR5 analysis up to EMC investigations or the reliability of the board under MIL-STD-810G.
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Thomas Benke from LEAP’s Electronics Team was invited to speak at Altium Designer 24 launch event in Sydney. This post offers a series of highlights from that presentation, covering industry trends, the recently announced Altium-Ansys Smart Bridge (including a live demonstration), followed by a discussion of typical simulation examples including PCB analysis.
How to use simulation to ensure switchgear functions to standards such as IEC 61439, incorporating effects such as: short circuit withstand strength, degree of protection of enclosures (arc fault), temperature rise, clearances and creepage distances, Dielectric properties of insulation, electromagnetic compatibility EMC.
This blog offers a detailed overview of the workflow to conduct virtual testing of Electrostatic Discharge using Ansys EMA3D – as early as possible in your design cycle once your PCB design is available – helping to reduce expensive recalls and warranty issues due to ESD failures in sensitive electronics.
Learn about Ansys EMA3D to account for cables and cable assemblies when accurately simulating EMI/EMC effects on larger platforms, such as aircraft and full vehicles.
In the final part of our series on using Electronics Reliability simulation tools to meet important industry standards, read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to meet the MIL-STD-810G standard relating to environmental and lab tests approved for use by the US Department of Defence.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the DO-160G standard which covers “Environmental Conditions and Test Procedures for Airborne Equipment” in the aerospace industry. PCBs installed in any airborne vehicles can be simulated in Ansys Sherlock to assess the vibrational and solder fatigue analysis in order to predict the life cycle/ Time-to-failure (TTF) of key components and the board itself.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the GMW3172 Standard for “General Specification for Electrical/Electronic Components – Environmental/Durability”, part of engineering standards by General Motors which applies to electrical components for passenger/commercial vehicles & trucks.
Read how to apply Reliability Physics Analysis (RPA) in Ansys Sherlock to the SAE J3168 standard, covering Electrical, Electronic, Electromechanical Equipment, Modules and Components. This standard was jointly developed by the SAE Automotive Electronic Systems Reliability Standards Committee and SAE Avionics Process Management Committee, and is the first reliability physics analysis (RPA) standard developed specifically for use in the Aerospace, Automotive, Defence and other High-Performance (AADHP) industries.
It is increasingly important for product designers to consider electronics durability and PCB reliability across the product’s entire service life – accounting for all external influences that it will experience during production, shipping, and the environment during its operation. Here we look at how simulation is used to satisfy the requirements dictated by common industry standards.
